WASHINGTON: LCD driver IC packaging specialist Chipbond Technology saw its June revenues climb to a 10-month high of NT$1.42 billion (US$44 million). Chipbond’s consolidated revenues for June 2016 represented a 2.6% on-year increase. Consolidated sales for the second quarter came to NT$3.99 billion, rising 6.8% sequentially.
Chipbond’s cumulative 2016 revenues through June totaled NT$7.72 billion, down 10.2% on year. Chipbond chairman Fei-Jain Wu was quoted in previous reports saying the company’s operation for 2016 would see its peak in the third quarter. Overall performance in the second half of 2016 is set to outperform that in the first half.
Chipbond is also looking to enhance its offerings for non-driver ICs. Sales generated from non-driver IC segments are expected to account for more than 20% of Chipbond’s total revenues in 2016, Wu indicated. Chipbond’s non-driver IC product line includes 12-inch wafer bumping services, wafer-level CSP and other backend services for power management ICs and power amplifiers, Force Touch chip solutions, baseband chips and other logic ICs.
