LONDON: Intel’s launch of its 6th Gen Core (“Skylake”) processors this week precipitated a flurry of COM Express module announcements by embedded board vendors.
Intel’s 48 new 6th Gen Core processors span an extremely wide range of power consumption and performance. At the low end are the mobile-oriented “Y-series” system-on-chips, starting with the dual-core, 2.2GHz-clocked Core m3-6Y30 that have 4.5 Watt TDPs and include internal platform controller hub (PCH) functionality for reduced silicon footprint and cost. At the other extreme you’ll find “S-series” processors, which top out with the gaming/overclocking-oriented, power-thirsty, 91 Watt TDP, 4.2GHz Core i7-6700K. In between are the 15 Watt TDP “U-series” and 45 Watt TDP “H-series” processors, which, along with the S-series, require the use of dedicated external PCH “chipsets.”
