The Kirin 980 system on a chip packs 6.9 billion transistors and delivers double the processing power for AI applications
Huawei Technologies, the world’s largest telecommunications equipment supplier, unveiled on Friday its new smartphone chip, the Kirin 980, designed to move the Chinese company ahead of Apple and Samsung Electronics in launching an integrated circuit made under the most advanced fabrication and has double the processing power for artificial intelligence (AI) applications.
“We’ve designed an all-around powerhouse that not only features outstanding AI capabilities, but also brings cutting-edge raw performance to consumers,” Richard Yu Chengdong, the chief executive of Huawei’s consumer business group, said on Friday during the product’s launch at the IFA trade show in Berlin, Germany.
The Kirin 980 is a premium system on a chip (SoC) built on the advanced 7-nanometre fabrication process of Taiwan Semiconductor Manufacturing Company (TSMC), the world’s biggest contract chip maker. An SoC typically combines a central processing unit, graphical processing unit, system memory, and various digital, analogue and mixed-signal components onto a single chip.
